MIL-DTL-47113D
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时间:2024-05-12 06:36:19
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MIL-DTL-47113D, DETAIL SPECIFICATION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (25 SEP 2001) [SUPERSEDING MIL-C-47113B]., This specification covers a silicone or non-silicone heat sink compoundwhich is applied to the base and mounting studs of transistors and diodes to provide a positiveheat sink seal.
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